Semiconductor

Full Automatic Blade Dicing Machine AD3000T-PLUS

Fully automatic frame handling, twin spindle dicing machine capable to accommodate workpiece of up to 300mm in diameter

  • Smallest footprint 300mm Frame Handling Dicing Machine in the World
  • Capable to process up to 300mm wafer size on 300mm dicing frame 
  • High processing speed: X-axis up to 1,000 mm/ sec & Y-axis up to 300 mm/sec
  • Standard Spindle up to 60,000 rpm compatible with blade up to 60mm in diameter
  • Improved user friendliness via 17inch touch panel and new intuitive Graphical User Interface with Help Function
  • Routine maintenance made easy with large front facing access panel
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AD3000T Plus
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  • SECSGEM ready and compatible for integration with customer network or in-house Saw-NET capability
  • Active Z upgradeable to realize high precision Z height control for better cutting quality
  • Compatible for Automatic Blade Exchange System (ABES) option to enhance productivity and minimize low tech errors during blade exchange process  

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